THE OFFICIAL ANDREASCY: Intel® Package on Package (PoP) BGA Rework Video: Description : Intel has developed the processes to remove and replace high density electronic components packaged in a Ball Grid Array,...
THE OFFICIAL ANDREASCY: Science Nation : New 3D Structures Assemble with R... : Description : While it is relatively straightforward to build a box on the macroscale, it is much more challenging at smaller micro and...
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